Modular Enclosure System

The brief was a single enclosure design that could cover a product range without redrawing the shell each time a board changed size. The result is a master model driven by a small table of parameters — internal volume, mount pitch, port cutouts — where a size change propagates through the assembly and drawings automatically.

Snap-fit geometry was tuned across four printed revisions until the assembly held under repeated opening cycles without fasteners. Wall thicknesses were set for both FDM prototyping and eventual injection moulding, so the same geometry carries from desk to tooling.

Replace this text with the real story: the constraint, the decision you made, and what shipped.